Advanced Packaging Process Integration Engineer

About Global Foundries:
Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

This advanced packaging process integration engineering role will lead post Fab process development to meet customer requirements. The candidate will have a strong focus on wafer finishing and assembly processes to support silicon photonics and other product lines.

• Lead packaging process development efforts and planning by working with the unit process engineers and directly with tools & materials suppliers for advanced packaging in Burlington, VT (Fab
  9).
• Drive semiconductor process development in CMP, wafer thinning, and dicing.
• Collaborate with unit process engineers to develop new processes for advanced packaging roadmaps.
• Lead next generation packaging and assembly development to support different product needs.
• Partner with internal design, fabrication and packaging teams to set assembly specs/requirements and drive new assembly flow/process development.
• Drive understanding of failure modes and work with cross functional teams to identify and resolve technical issues.
• Adopt design for cost methodology to enable continuous improvement projects.
• Generate IP related to novel wafer integration & packaging technology.
• Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
• Develop expertise in processes, materials and tooling to leverage available characterization resources.
• Collaborate with OSATs (Outsourced Assembly and Test) to develop new packaging integration processes.

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Other duties as assigned by the manager.

• Education
  - PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related fields from an accredited degree program.
• At least 15 years of prior related work experience in wafer finishing (thinning, dicing, bumping, and RDL) and assembly processes.
• Language Fluency
  - English (Written & Verbal).
• Travel
  - Up to 10%.

• Experience in bringing packaged products from development into production.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.

Expected Salary Range $ - $ The exact Salary will be determined based on qualifications, experience and location.

The role you are applying for may require you to obtain a US Department of Defense Security Clearance at some time during your employment. Acceptance of this role commits to applying for such if requested. Further, the applicant consents to being asked questions about their citizenship and background to assess the likelihood of obtaining a Security Clearance. The applicant also acknowledges that Global Foundries can only nominate and submit an application for a Security Clearance.

The granting of a Security Clearance is at the sole discretion of the U.S. Government and the Department of Defense.

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