Advanced Packaging Cryogenic Modeling Engineer

Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

Global Foundries is seeking an experienced thermal, mechanical, and/or electrical modeler/engineer with demonstrated cryogenic modeling experience to support cryogenic packaging and system co-optimization R&D. The engineer will leverage commercial multi-physics tools to build, correlate, and apply models that capture low-temperature material property behavior and thermo-mechanical effects (e.g., thermal contraction and CTE mismatch) to guide device, integration, and cryogenic 3

DHI advanced packaging optimizations for mechanical, thermal, and/or electrical performance.

• Demonstrated experience using commercial software to develop and correlate cryogenic thermal, mechanical, and/or electrical models for semiconductor devices and advanced packages (e.g., 77 K and below), including temperature-dependent material properties and boundary conditions.
• Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling.
• Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling.
• Facilitate discussion with originating team to identify simulations that highlight critical process interactions and drive optimal 3
  
  DHI technology decisions.
• Apply commercial simulation software to mimic cryogenic semiconductor process flows and highlight the areas of concern.
• Extensive interaction with integration, device, and design engineers to assure development of a working technology.

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Other duties as assigned by manager.

• M.S. + minimum of 10 years of relevant experience.
• Semiconductor mechanical, thermal and/or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications.
• Strong problem solving and technical trouble shooting skills includingexpertisein design of experiment.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency
  - English (Written & Verbal).
• Solid understanding of semiconductor processes and integration techniques.
• Good computer / software skills.
• Ability to clearly present results to small and large groups.
• Travel
  - Up to 10%.

• PhD + 8 years of relevant experience.
• Thermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS…).
• Demonstrated work performance in an environment requiring a high level of attention to detail and timeliness.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning & organizational skills.

$ - $ The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process,…