Senior 3D/5D Heterogeneous Packaging Engineer
Listed on 2026-10-11
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Engineering
Packaging Engineer, Systems Engineer
Global Foundries is seeking a senior engineer for chiplet-based 2.5D/3D integration across silicon, glass and mold interposers, including embedded silicon bridges. You will own end-to-end integration and work with fabrication, design, and reliability teams.
The role emphasizes leadership, innovation, and collaboration with external partners to advance heterogeneous integration capabilities for multiple programs. Requires 10+ years of related experience and an MS degree.
This is an excellent opportunity to take on the Senior 3D/2.5D Heterogeneous Packaging Engineer role at GLOBALFOUNDRIES U.S. 2 LLC.
We are currently recruiting a Senior 3D/2.5D Heterogeneous Packaging Engineer for our team in Essex Junction, VT, United States.
As a Senior 3D/2.5D Heterogeneous Packaging Engineer, you will play an important part at GLOBALFOUNDRIES U.S. 2 LLC in Essex Junction, VT, United States.
We invite applications for the Senior 3D/2.5D Heterogeneous Packaging Engineer position located in Essex Junction, VT, United States.
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