Quantum Packaging Intern: Advanced Processing & Innovation
Listed on 2026-10-11
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Engineering
Packaging Engineer, Process Engineer -
Manufacturing / Production
Packaging Engineer
Global Foundries is offering an internship in APL Quantum packaging development in the United States. The role involves executing experiments and supporting wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer work alongside engineering teams.
Interns will analyze experimental data, build process models, and contribute to daily integration and development activities. This six-month coop emphasizes mentorship, professional growth, and exposure to advanced semiconductor packaging
Join us at GLOBALFOUNDRIES U.S. INC. as our next Quantum Packaging Intern:
Advanced Processing & Innovation in Essex Junction, VT, United States.
Full responsibilities and requirements are described in the listing above.
Learn more about the Quantum Packaging Intern:
Advanced Processing & Innovation role in the description above.
We appreciate your interest in this position.
Join GLOBALFOUNDRIES U.S. INC. and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
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