APL Quantum Intern; Summer Essex, VT, US Posted

Position: APL Quantum Intern (Summer 2027) Essex, VT, US Posted a day ago
## APL Quantum Intern (Summer 2027)
Essex Junction, Vermont, United States of America Apply Now Find out how well you match with this job

Requisition :
JR-2604434

Date posted:
10/07/2026

Time Type:
Full time
** About Global Foundries
** Global Foundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability.

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** Internship Program Overview:
** Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives.

** Summary of Role:
** The APL Quantum Intern will contribute to quantum advanced packaging development, including wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer development. The intern will work alongside engineering teams to execute experiments, analyze results, model processes, and support daily integration and process-development activities.

** Essential

Responsibilities include:

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* * Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.
* Analyze and interpret engineering data from experiments, process optimizations, and development activities.
* Develop or support process models to improve understanding of advanced packaging and integration performance.
* Assist engineers with daily integration, process-development, documentation, and problem-solving activities.
* Communicate experimental results, technical findings, and recommended next steps to project stakeholders.  
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* Other Responsibilities:

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* * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.  
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* Required Qualifications:

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* * Education – At least a sophomore at time of application and actively pursuing a Bachelor’s or Master’s in Engineering or related field through an accredited degree program during the time of internship.
* Must have at least an overall 3.0 GPA and be in good academic standing.
* Language Fluency - English (Written & Verbal)
* Travel - Up to 10%
* Ability to work at least 40 hours per week during the internship.  
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* Preferred Qualifications:

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* * Prior related internship or co-op experience
* Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
* Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
* Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
* Strong written and verbal communication skills
* Strong planning & organizational skills
* Currently pursuing a PhD in Engineering or related field through an accredited degree program during the internship
* Experience with advanced semiconductor packaging, semiconductor integration, hybrid bonding, TSV/TOV, interposers, design of experiments, or engineering data analysis
* Availability for a six-month co-op assignment is…