Quantum Packaging Intern: Design, Data & Integration
Listed on 2026-10-15
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Engineering
Packaging Engineer
Global Foundries is offering an internship program in the US for the APL Quantum Intern role. You will contribute to quantum advanced packaging development, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development.
You will work with engineering teams to run experiments, analyze results, model processes, and support daily integration and development activities. The internship includes mentorship, growth-focused assignments, professional development, and networking
This is a great opportunity to take on the Quantum Packaging Intern:
Design, Data & Integration role at Global Foundries.
We are looking to fill the Quantum Packaging Intern:
Design, Data & Integration position at Global Foundries in Essex Junction, VT, United States.
The Quantum Packaging Intern:
Design, Data & Integration role at Global Foundries is now open for applications in Essex Junction, VT, United States.
Join us at Global Foundries as our next Quantum Packaging Intern:
Design, Data & Integration in Essex Junction, VT, United States.
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