Data Center Thermal Architect: -Density Cooling
Listed on 2026-10-06
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IT/Tech
Systems Engineer, Engineering Design & Technologists -
Engineering
Systems Engineer, Engineering Design & Technologists
Ingersoll Rand is seeking a Data Center Thermal Application Engineer to design and deploy advanced cooling solutions for high-density workloads (AI/ML, HPC). This role covers liquid cooling with CDUs and direct-to-chip cooling, as well as high-performance air cooling with dry coolers and fan arrays.
You will collaborate with CDU suppliers, perform thermal calculations, validate designs with CFD tools, and support installation, commissioning, and optimization across sites in OR/PA.
This is an excellent position to take on the Data Center Thermal Architect:
High-Density Cooling role at Ingersoll Rand.
We are looking to fill the Data Center Thermal Architect:
High-Density Cooling position at Ingersoll Rand in Eugene, OR, United States.
The Data Center Thermal Architect:
High-Density Cooling role at Ingersoll Rand is now open for applications in Eugene, OR, United States.
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