Thermal & Thermo-Mechanical Engineer, Semiconductor Packaging
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Engineering
Job Description & How to Apply Below
Acceler8 Talent is seeking a Thermal & Thermo-Mechanical Engineer in a hands-on, fast-paced environment. The role focuses on modeling dense, multi-material semiconductor packages and 3D systems, translating simulations into practical design choices for architecture, materials, interfaces and cooling.
Ideal candidates will own thermal analysis from simulation through hardware validation, collaborating with electrical, packaging and reliability teams to resolve trade-offs.
We are seeking a motivated Thermal & Thermo-Mechanical Engineer, Semiconductor Packaging to join Acceler8 in MA, United States.
We invite applications for the Thermal & Thermo-Mechanical Engineer, Semiconductor Packaging position located in MA, United States.
The following opportunity is for a Thermal & Thermo-Mechanical Engineer, Semiconductor Packaging with Acceler
8.
Our team is growing, and we are hiring a Thermal & Thermo-Mechanical Engineer, Semiconductor Packaging in MA, United States.
This opportunity is for the Thermal & Thermo-Mechanical Engineer, Semiconductor Packaging role at Acceler
8.
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