HBM Architect: Mixed-Signal Design, Power & Thermal
Listed on 2026-10-06
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Engineering
Hardware Engineer, Electronics Engineer, Engineering Design & Technologists -
Design & Architecture
Engineering Design & Technologists
Micron Technology is seeking a Design Architect at Senior/Principal/Staff level to shape next-generation high-bandwidth memory (HBM) architectures. You will design, simulate, and optimize analog/mixed-signal circuits and power delivery for 3D-stacked memories, working with peer teams to set specifications and interfaces.
The role emphasizes architecture definition, thermal/power management, and pathfinding for future stacked-memory products, with opportunities to contribute to scripting
Are you ready to take on the HBM Architect:
Mixed-Signal Design, Power & Thermal role at Micron Technology?
The HBM Architect:
Mixed-Signal Design, Power & Thermal position in the Engineering field is open for applications.
We have an opening for a HBM Architect:
Mixed-Signal Design, Power & Thermal in Folsom, CA, United States within Engineering.
This role, HBM Architect:
Mixed-Signal Design, Power & Thermal at Micron Technology, could be your next opportunity.
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