HBM SoC RTL Design Engineer AI Chips

Micron Technology is seeking a SoC Design Engineer to join the Heterogeneous Integration Group in California. You will design RTL for SoC-level blocks in HBM logic die and integrate IP, collaborating with architecture, verification, and physical design teams to meet power, performance, and schedule targets.

You will also help enable AI-driven tools and workflows, participate in pre- and post-silicon bring-up, and contribute to design documentation and reviews to ensure robust, manufacturable

We are seeking a motivated HBM SoC RTL Design Engineer:
High-Performance AI Chips to join Micron Technology in Folsom, CA, United States.

This role is for the HBM SoC RTL Design Engineer:
High-Performance AI Chips role at Micron Technology.

Consider building your career as a HBM SoC RTL Design Engineer:
High-Performance AI Chips at Micron Technology.

The HBM SoC RTL Design Engineer:
High-Performance AI Chips position in the Engineering field is open for applications.