Mixed‑Signal Design Architect ‑Gen HBM Systems
Listed on 2026-11-04
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Engineering
Electronics Engineer, Hardware Engineer -
Design & Architecture
Micron Technology, Inc. seeks a Senior/Principal Engineer or Senior Staff to design, simulate, and optimize 3D-stacked, high-performance memories for AI workloads.
You will lead analog/mixed-signal circuit efforts, power delivery architectures, and interface specifications in collaboration with architecture teams. Responsibilities include defining architectures, evaluating thermal and power delivery, and prototyping on-/off-chip interfaces while maintaining clear documentation and advancing
We are currently recruiting a Mixed‑Signal Design Architect for Next‑Gen HBM Systems for our team in Folsom, CA, United States.
This is a genuine opportunity to take on the Mixed‑Signal Design Architect for Next‑Gen HBM Systems role at Micron Technology, Inc.
As a Mixed‑Signal Design Architect for Next‑Gen HBM Systems, you will play an important part at Micron Technology, Inc in Folsom, CA, United States.
We invite applications for the Mixed‑Signal Design Architect for Next‑Gen HBM Systems position located in Folsom, CA, United States.
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