HBM SoC Physical Design Engineer Intern
Listed on 2026-11-04
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Engineering
Test Engineer, Electronics Engineer, CAD/ AutoCAD/ Mechanical Design, Hardware Engineer
Micron Technology, Inc is seeking a motivated SoC Physical Design Intern to support the HBM team in implementing advanced memory designs for AI and data center workloads.
You will gain hands-on experience with floor planning, timing analysis, signoff flows, and automation using Python and Tcl, collaborating across architecture, RTL, verification, and signoff to deliver high‑performance, power‑efficient silicon.
We invite applications for the HBM SoC Physical Design Engineer Intern position located in Folsom, CA, United States.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Folsom, CA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 81..
We aim to respond to suitable candidates as soon as possible.
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