HBM SoC Physical Design Engineer — PPA & Tape
Listed on 2026-11-04
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Engineering
Electronics Engineer, Hardware Engineer, Systems Engineer
Micron Technology, Inc. is seeking a SoC Physical Design Engineer in the Heterogeneous Integration Group to drive implementation from netlist to GDSII and ensure top‑level integration across products.
You will collaborate with RTL, verification, DFT, IP, packaging and manufacturing teams to optimize PPA and meet tape‑out milestones while enabling AI‑driven workflows in PD methodologies.
The HBM SoC Physical Design Engineer — PPA & Tape-out Ready position in the Engineering field is open for applications.
Are you ready to take on the HBM SoC Physical Design Engineer — PPA & Tape-out Ready role at Micron Technology, Inc.?
We would love to welcome a new HBM SoC Physical Design Engineer — PPA & Tape-out Ready to our group in Folsom, CA, United States.
For the HBM SoC Physical Design Engineer — PPA & Tape-out Ready position at Micron Technology, Inc., we are reviewing applications now.
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