Mixed-Signal Design Architect D HBM Memory
Listed on 2026-11-05
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Engineering
Hardware Engineer, Electronics Engineer, Engineering Design & Technologists, Architect / Sr. Architect -
Design & Architecture
Engineering Design & Technologists, Architect / Sr. Architect
Micron Technology, a world leader in memory and storage, seeks a Senior Engineer/Principal Engineer/MT&S Design Architect for the Next‑generation HBM Architecture Team in the US. You will design, simulate, analyze and optimize 3D‑stacked high‑performance memories for AI workloads, collaborating with architecture and design peers.
Responsibilities include defining circuit implementations, technology requirements, thermal improvements, power delivery, and interfaces, with emphasis on
We have an opening for a Mixed-Signal Design Architect for 3D HBM Memory in Folsom, CA, United States within Engineering.
The Mixed-Signal Design Architect for 3D HBM Memory position in the Engineering field is open for applications.
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