Senior ESD & Latch-Up Architect -Speed Memory

Micron Technology, Inc. in Folsom, CA is seeking a Sr. Member Technical Staff to define end-to-end ESD and latch-up architectures for next-generation HBM devices.

You will shape reliability from architecture to silicon validation, collaborating across device, circuit and packaging teams. Responsibilities include establishing ESD/LUP standards, developing protection strategies for high-speed I/O, TSV interfaces, and multi-die memories, and driving design-signoff criteria with cross-functional

Join us at Micron Technology, Inc. as our next Senior ESD & Latch-Up Architect for High-Speed Memory in Folsom, CA, United States.

We invite applications for the Senior ESD & Latch-Up Architect for High-Speed Memory position located in Folsom, CA, United States.

The following opportunity is for a Senior ESD & Latch-Up Architect for High-Speed Memory with Micron Technology, Inc.

Our organisation is growing, and we are hiring a Senior ESD & Latch-Up Architect for High-Speed Memory in Folsom, CA, United States.