Mixed-Signal Design Architect D HBM Memory

Micron Technology, a world leader in memory and storage, seeks a Senior Engineer/Principal Engineer/MT&S Design Architect for the Next‑generation HBM Architecture Team in the US. You will design, simulate, analyze and optimize 3D‑stacked high‑performance memories for AI workloads, collaborating with architecture and design peers.

Responsibilities include defining circuit implementations, technology requirements, thermal improvements, power delivery, and interfaces, with emphasis on

We are seeking a motivated Mixed-Signal Design Architect for 3D HBM Memory to join Micron Technology, Inc. in Folsom, CA, United States.

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Join Micron Technology, Inc. and contribute to our ongoing work.

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This posting is for the Mixed-Signal Design Architect for 3D HBM Memory role at Micron Technology, Inc., based in Folsom, CA, United States.