Mixed‑Signal Design Architect ‑Gen HBM Systems
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Engineering
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Design & Architecture
Job Description & How to Apply Below
Micron Technology, Inc. seeks a Senior/Principal Engineer or Senior Staff to design, simulate, and optimize 3D-stacked, high-performance memories for AI workloads.
You will lead analog/mixed-signal circuit efforts, power delivery architectures, and interface specifications in collaboration with architecture teams. Responsibilities include defining architectures, evaluating thermal and power delivery, and prototyping on-/off-chip interfaces while maintaining clear documentation and advancing
We are looking to fill the Mixed‑Signal Design Architect for Next‑Gen HBM Systems position at Micron Technology, Inc. in Folsom, CA, United States.
Our team is growing, and we are hiring a Mixed‑Signal Design Architect for Next‑Gen HBM Systems in Folsom, CA, United States.
This opening is for the Mixed‑Signal Design Architect for Next‑Gen HBM Systems role at Micron Technology, Inc.
We are seeking a motivated Mixed‑Signal Design Architect for Next‑Gen HBM Systems to join Micron Technology, Inc. in Folsom, CA, United States.
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