Senior Flip-Chip BGA Package Designer – SerDes & RF

A leading technology recruitment firm is seeking an experienced Package Design Engineer in Fort Collins, Colorado. This role involves designing complex flip-chip-BGA packages, particularly for ASICs in high-speed Ser Des and RF communications. The ideal candidate has over 12 years of relevant experience and strong skills in Cadence tools, collaboration, and project management. This position offers a chance to innovate within a worldwide R&D team focused on developing cutting-edge technologies.
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