ASIC Eng Intern — Innovate Packaging Design
Listed on 2026-10-06
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Engineering
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Design & Architecture
AMD is seeking an ASIC Packaging intern/co-op in Fort Collins as part of its co-op/intern program. You will work with a team of engineers on advancing packaging technology and bring new AMD products toward reality.
This role is designed for a US-based Master’s student in related fields and involves hands-on design work. Responsibilities include supporting package design, substrate and bump design, design verification, and yield analysis.
Our organisation is growing, and we are hiring a ASIC Package Eng Intern — Innovate Packaging Design in Fort Collins, CO, United States.
Learn more about the ASIC Package Eng Intern — Innovate Packaging Design role in the description above.
We appreciate your interest in this position.
Join AMD and contribute to our ongoing work.
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