Lead .5D/3D Advanced Package Engineer
Listed on 2026-10-07
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Engineering
Packaging Engineer, Process Engineer, Manufacturing Engineer, Systems Engineer
Broadcom Inc. is seeking an Advanced Package Technology Engineer to develop cost-effective, high-performance 2.5D/3D packaging solutions.
The role involves close collaboration with silicon, packaging, design, and supplier teams to meet ambitious timelines and performance goals. The candidate should have hands-on 4–6 years in 2.5D/3D development, strong knowledge of substrates, interposers, and related processes, and proven project management and collaboration skills.
This is an excellent position to take on the Lead 2.5D/3D Advanced Package Engineer role at Broadcom Inc.
We are currently recruiting a Lead 2.5D/3D Advanced Package Engineer for our team in Fort Collins, CO, United States.
This is a great position to take on the Lead 2.5D/3D Advanced Package Engineer role at Broadcom Inc.
As a Lead 2.5D/3D Advanced Package Engineer, you will play an important part at Broadcom Inc. in Fort Collins, CO, United States.
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