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Hardware Intern - Architecture, AI HW & System Chip

Job in Fort Collins, Larimer County, Colorado, 80523, USA
Listing for: Tenstorrent University Jobs
Apprenticeship/Internship position
Listed on 2026-10-10
Job specializations:
  • Engineering
    Hardware Engineer, Systems Engineer, Test Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 69000 - 96000 USD Yearly USD 69000.00 96000.00 YEAR
Job Description & How to Apply Below
Hardware Intern - Architecture, AI HW & System on a Chip

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible.

We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Overview: Before a single transistor gets placed, someone has to decide what the chip should actually be and ensure it functions to specs. This team makes those calls including System on a Chip (SoC)
-level architecture, fabric/interconnect design, verification and not just core compute.

What you might work on: This posting spans multiple teams within Hardware Architecture & AI Hardware and SoC . One application, one recruiter screen - then we match you to the specific team and location that fits best. What each team does:

  • Architecture: We define and evaluate the system, CPU, memory, fabric, and chiplet-level decisions that shape future products. We analyze workloads, performance, power, and system requirements, develop architectural models, do tradeoff analyses, and specifications for implementation.
  • AI Hardware: We design and develop the core AI accelerator IP, including compute, data movement, and other specialized hardware blocks that enable high-performance AI workloads. We take these IPs from requirements through RTL design, verification, and delivery for SoC integration.
  • SOC : Our team is where everything comes together. We design and verify the integration of all subsystems and the final pieces that allow the chip to interact with the outside world; scaleout, memory and on-chip system management and security. We validate cross functional and performance requirements, and ultimately take the design to silicon.

This role is on-site, based out of Boston, MA or Austin, TX or Fort Collins, CO or Santa Clara, CA.

Who You Are

  • Currently pursuing a BS, MS, or PhD in EE, ECE, CE, or CS.
  • Coursework or projects in digital design, computer architecture and performance modeling.
  • Self-starter who brings sound judgment and practical problem-solving to every project with a solid interest in AI and hardware, along with the ability to take ownership and deliver results.

What We Need

  • Familiarity with ASIC design concepts, ranging from performance simulations, RTL design / verification, and logic synthesis / timing analysis
  • Scripting & programming skills (example: Python, PERL, tcl, C/C++); with experience using AI coding platforms
  • [Architecture] Experience with architectural simulators.
  • Exposure to RISC-V or other open ISAs is nice to have.
  • FPGA design experience is nice to have.

What You Will Learn

  • Taking designs from specification to RTL to verification, and learning the qualification checks and tools needed to do so.
  • How architectural tradeoffs (Architecture: Compute vs. memory vs. interconnect. AI HW/ SOC: Power, Performance & Area) get decided with data, not intuition.
  • Best practices for cross-functional collaboration, seeing firsthand how Architecture, RTL, Software, and Physical Design teams stay aligned through implementation.
  • Practical methods to integrate AI tools directly into your daily technical workflow.
  • [Architecture] Performance modeling methodology used before RTL existed.

USA Hiring Timelines

This internship opportunity is available throughout our 3 terms with the following corresponding recruitment cycles:

  • Fall Term:
    Sept–De…
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