Reliability Engineer

Broadcom is a world leader in custom ASIC design including but not limited to cutting edge AI solutions. Broadcom is in search of a Reliability Engineer to join Broadcom's Global Operations Quality Assurance Team in Fort Collins, CO. The Reliability team enables Broadcom to bring leading edge Silicon and Packaging solutions to market by performing reliability qualifications. This hands-on engineering position will consist of interacting with the various BRCM Business Units (BU’s) as they engage with the REL Lab (Fort Collins) for qualification support for new products.

Responsibilities will include working with teams both internal and external to Broadcom to ensure all necessary data is provided to meet qualification schedules. Generate hardware specifications for external board vendors. Responsible for board design review and thermal solution verification prior to PCB fabrication. Secondary responsibilities will include setup, verification, and checkout for HTOL.

A successful Reliability Engineer is a highly motivated, self-starter with excellent communication skills and an active team member. The candidate will know or be able to learn reliability qualification, including design, verification and setup and debug to successfully support Broadcom’s leading edge Silicon and Packaging solutions. Strong hardware design and or ASIC test engineering experience is a must.

• Board hardware schematic and layout review.
• Thermal head simulation and design review.
• Liaise between various external vendors and internal Business Units (BUs).
• Converting HTOL vectors to run on in-house MCC HTOL systems.
• Provide technical engineering support for the REL Lab team.
• Board, socket debug for setup or vector issues.
• Complete initial biased stress certifications.
• Working with BUs to develop biased and unbiased stress testing plans for critical projects.
• Manage biased stress project schedules (Internal and External) to critical milestones.
• Ensure REL project completion to meet the qualification expectations.

BS Degree in Engineering (Electrical, Mechanical, Computer) or related field and 8+ years of related experience is desired. Less than 8 years of related experience or a degree in other Engineering or Science disciplines will be considered on an individual basis.

Understanding of Reliability Qualification stress tests. HTOL, HTS, TC, THB, uHAST, bHAST, Preconditioning / Reflow Test engineering experience. Schematic design and PCB layout design / review. Strong attention to detail with ability to catch schematic and board layout errors. Able to utilize AI to develop software tools to aid in complex and tedious tasks. Familiarity with industry IC stress test standards: JEDEC, Mil-Std, etc.

Minimum of 5 years of experience in a REL Lab environment Able to juggle multiple projects in various stages of development & completion across several business units with differing priorities. A background in Automated Test Equipment (ATE), Test Engineering, IC Chip Design or Hardware Design would be a plus. Experience with Micro Control Company (MCC) HTOL, AEHR Test Sonoma HTOL, and/or Biased HAST Equipment.

Experience with running HTOL and bHAST projects for various IC products. Experience with electrical bench test setup, measurement, and debug. Hands-on experience in support of HTOL projects. Proven track record in a lab team environment. This role supports multiple Broadcom BUs. It is imperative that the individual be able to work efficiently and independently, while also communicating effectively and professionally in online meetings, by email, and by phone.

Work shift flexibility may be required for special circumstances for critical project…