Research Member of Technical Staff, Materials and Manufacturing

Lead research that connects materials and semiconductor packaging processes to the needs of computing systems. You will take work from measurable requirements through controlled experiments, process and reliability assessment, and evidence for possible manufacturing transfer. Advanced packaging is the intended initial focus; no production fab is currently operating.

• Turn thermal, electrical, mechanical, memory, and reliability constraints into material and process targets.
• Plan controlled experiments, including comparators, sample plans, metrology, statistical analysis, and decision criteria.
• Set requirements for contamination control, process monitoring, reliability testing, yield learning, and failure analysis.
• Assess materials, interfaces, equipment, suppliers, scale-up, safety, and transfer readiness.
• Connect results to device and package behavior, operating conditions, cost, supply, and repeatability.
• Coordinate scoped research with external labs or industry partners when access, safety, rights, supervision, and funding are established.

• PhD or equivalent research depth in materials science, chemical or mechanical engineering, semiconductor processing, packaging, or a related field.
• Experience designing controlled experiments and interpreting characterization, metrology, reliability, yield, or process data.
• Understanding of contamination, chemical and equipment safety, process variation, yield, and manufacturing transfer.
• Ability to relate material properties to device, package, thermal, mechanical, or manufacturing behavior.
• Experience coordinating across design, process, equipment, metrology, test, and research teams.
• Clear communication about supporting evidence, inferences, and open questions.

• Experience with HBM, hybrid bonding, 2.5D or 3D integration, or advanced packaging.
• Background in thin films, interfaces, thermal transport, mechanical reliability, process integration, DOE, or SPC.
• Familiarity with inline metrology, defect inspection, yield analysis, and physical or electrical failure analysis.
• Experience with pilot lines, equipment or supplier qualification, high-volume manufacturing, or technology transfer.