Sr Principal Photonics Engineer - Optical Solutions

Sr Principal Photonics Engineer – Optical Solutions

Molex has a rich heritage in the optical industry, providing high performing field‑proven silicon photonics solutions from PIC design to optical transceiver module implementation. We are one of the few TRx manufacturers shipping high‑volume Si photonics devices, continuously innovating device speed beyond 100 GHz, scaling PIC integration, and developing optical engines compatible with advanced 2.5 D/3 D IC packages for co‑packaged optics. These capabilities serve high‑density, high‑data‑capacity, low‑power optical modules for hyper‑scale data centers and AI clusters.

• Acquire expert understanding of advanced Si photonics to drive innovation of new optical devices.
• Conduct thorough analysis of optical system requirements and define component specifications to ensure required performance.
• Collaborate with industry design partners and internal/external customers to align optoelectronic component and PIC design strategies.
• Assess process capabilities required for target component specifications.
• Perform feasibility studies to verify new design strategies and propose novel technology development to advance capabilities.
• Collaborate with strategic customers on joint development of technology or PIC solutions.
• Work with multidisciplinary design teams to validate PIC design integration with optical, mechanical, module fabrication, hardware circuit, and controls.
• Mentor other engineers and cross‑functional groups on PIC design implications.

• PhD in Engineering, Physics, Photonics or a related technical field.
• At least 15 years of industry experience in designing or managing optoelectronics component design and development.
• At least 7 years of industry experience with Si photonics.
• Experience leading the development of Si photonics PIC solutions.
• Strong knowledge of high‑speed optoelectronics device design.
• Knowledge of CMOS semiconductor process.
• Knowledge of semiconductor wafer backend and package ecosystem.
• Knowledge of EDA or EPDA tools for PIC design, simulation, and tape‑out process.

For this role, we anticipate paying $200,000 - $275,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.

Equal Opportunity Employer, including disability and protected veteran status. The employer uses E‑Verify.

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