Cryogenic RF Packaging & Substrate Engineer
Listed on 2026-10-16
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Engineering
Packaging Engineer, Electronics Engineer, Systems Engineer, Manufacturing Engineer
Translarity, Inc. is expanding its wafer test and packaging capabilities and seeking an engineer to design package and substrate hardware for quantum computing applications.
This role involves working at cryogenic temperatures, handling microwave signals, and pushing conventional packaging concepts beyond the standard rules. You will start from strong fundamentals and drive designs from concept to production.
The Cryogenic RF Packaging & Substrate Engineer position in the Engineering field is open for applications.
This is a strong position to take on the Cryogenic RF Packaging & Substrate Engineer role at Translarity, Inc.
As a Cryogenic RF Packaging & Substrate Engineer, you will play an important part at Translarity, Inc. in Fremont, CA, United States.
We invite applications for the Cryogenic RF Packaging & Substrate Engineer position located in Fremont, CA, United States.
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