Senior Foundry and OSAT Manager

Molex is seeking a Senior Foundry and Semiconductor Backend Manager to provide technical and operational leadership for outsourced semiconductor manufacturing, assembly, packaging, and test activities supporting ASIC and co-packaged product development.

This position will serve as a key technical interface among ASIC designers, semiconductor foundries, outsourced semiconductor assembly and test providers, system engineers, packaging and module designers, silicon photonics engineers, laser engineers, project managers, quality teams, and other internal and external stakeholders. The role will have primary responsibility for coordinating semiconductor foundry interfaces and backend processes, including bumping, redistribution layers, wafer preparation, assembly, packaging, qualification, and test.

The successful candidate will combine strong semiconductor process and packaging expertise with effective supplier management, structured problem-solving, and cross-functional leadership. Significant interaction with global suppliers is required, including meetings outside normal business hours and occasional travel to vendor locations.

Molex is an industry leader in transforming optical network infrastructure with an unwavering commitment to speed, reliability, and performance. We proudly engineer high-performance systems for critical, fast-growing industries including data centers, telecom, medical, and industrial automation. Our team develops an advanced portfolio of optical solutions, ranging from cutting-edge optical connectivity products—such as expanded beam connectors, fiber management, adapters, and hybrid copper/fiber solutions for medical systems—to end-to-end optoelectronic solutions featuring cages, connectors, optical transceivers, and cable assemblies.

Supporting extreme data rates from 100 Mbps to 1.6 Tbps across long‑haul distances up to 80km+, we deliver complete wavelength management and turnkey OEM solutions. Come join Molex and help build the future of global connectivity.

• Serve as the primary technical point of contact for semiconductor foundries, bumping suppliers, OSAT partners, and other backend manufacturing vendors.
• Coordinate technical reviews, process readiness, manufacturing schedules, qualification activities, supplier change notifications, deviations, and issue resolution.
• Manage multiple outsourced manufacturing partners and align their deliverables with ASIC development, product introduction, and program milestones.
• Support supplier assessments, process transfers, second-source qualifications, and manufacturing risk mitigation.
• Track supplier yield, quality, qualification, and technical performance, escalating critical issues when necessary.

• Provide technical ownership of outsourced semiconductor backend processes, including wafer bumping, redistribution layers, wafer thinning and dicing, die attach, flip‑chip assembly, wire bonding, BGA or CSP assembly, underfill, multi‑chip integration, wafer sort, and final test.
• Define, review, and maintain package and assembly specifications, drawings, process requirements, and quality criteria.
• Review and approve supplier process flows, design‑for‑manufacturing reports, process change notifications, qualification plans, and manufacturing deviations.
• Work with package, substrate, PCB, and SMT engineers to align package‑side and board‑side requirements, including ball maps, pitch, coplanarity, land and stencil design, reflow, underfill, standoff, escape routing, and rework requirements.
• Provide subject‑matter expertise to system, module, silicon photonics, laser, ASIC, and related development teams.