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Staff Scientist

Job in Golden, Jefferson County, Colorado, 80401, USA
Listing for: Vescent
Full Time position
Listed on 2026-10-17
Job specializations:
  • Engineering
    Research Scientist
  • Research/Development
    Research Scientist
Salary/Wage Range or Industry Benchmark: 145000 - 190000 USD Yearly USD 145000.00 190000.00 YEAR
Job Description & How to Apply Below

Staff Scientist - Photonic Integrated Circuit Development (PIC)

Job Type: Full Time

Salary: $145,000 - $190,000 based upon education, work experience, and skill

About Us

Vescent Technologies is a recognized leader in quantum technologies.

This includes both: i) foundational technologies such as laser frequency control systems, optical frequency combs, electro-optical modules, and feedback control electronics, and ii) complete solutions such as next generation atomic clocks and time distribution, control systems for quantum computers, and deployed quantum sensors. The work environment is fun, fast-paced, challenging, and interdisciplinary. The Vescent team takes pride in its work, is energetic and agile, and enjoys celebrating team successes.

Position

Summary

Vescent Technologies seeks a creative and highly driven laser scientist to join our Research & Development team in Golden, CO. The right candidate will work on state-of-the-art laser and optoelectronic systems with a focus on the development, construction, and testing of photonic integrated circuits (PICs). The candidate will be efficient in their work ethic, highly self-motivated, and enthusiastic about laboratory research in an industrial setting.

The candidate will manage research projects as a principal investigator and seek new funding opportunities for next-generation research and development to complement and enhance Vescent's existing product lines. Approximately 60-80% of the candidate’s time will require on-site tasks with an opportunity for travel to conferences and customer site-visits.

Responsibilities
  • Analyze, model, design, assemble, layout, and test photonic integrated circuits (PICs) for applications in laser stabilization and nonlinear optics.
  • Develop packaging methods for efficiently coupling light into and out of PICs.
  • Conduct in-laboratory research (estimated 25-50% of candidates time on a monthly basis).
  • Mentor and train research staff in best practices for laboratory methods, data analysis, and presentation/report-writing.
  • Write winning proposals to secure development funding via government and commercial contracts.
  • Manage contract research projects to be on time and within budget, including effective communication with customers, industry/academic partners, and vendors.
  • As part of a highly cross-functional product development team, work closely with other team members to capture product requirements, provide subject matter expertise, analyze designs, troubleshoot prototypes, and perform use case test validation.
  • Transition assembly and testing of prototype development systems to production/process engineers and technicians as needed.
  • Travel requirements:
    Occasional (5-10% total) trips to conferences, fabrication facilities, and/or customer site visits.
Required Qualifications
  • Ph.D. in Physics, Optics, Optical Engineering, Electrical Engineering, or equivalent degree in relevant field. M.S's with >5 years of industrial experience will also be considered.
  • At least 5 years performing hands-on research in an optics/laser laboratory with direct experience in designing, modelling, and testing PICs.
  • Expertise in nonlinear optics and pulse propagation using ultrafast laser systems.
  • Demonstrated proficiency in computer programming (Python preferred), data analysis tools, and physical simulations including nonlinear waveguide propagation software.
  • Demonstrated technical writing experience including providing relevant writing samples (peer-reviewed publications are acceptable).
  • PIC expertise related to nonlinear optics, phase modulation, amplitude modulation, on-chip optical frequency references for laser stabilization, and electro-optical on-chip interfacing.
  • Packaging of PICs with micro-optics, optical fibers, other PIC platforms, and…
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