Wafer Fab Process Engineer

Wafer Fab Process Engineer at Teledyne Technologies Incorporated

As part of the uncooled detector (focal plane array) research and development team, the successful candidate will have responsibility for engineering wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for next‑generation infrared detector designs. The candidate will design and implement new processes, automate or improve existing ones, and own different tools and associated modules. Characterization of wafers and devices using SEM, FIB/SEM, and other metrology tools will also be required.

Hands‑on wafer fabrication and characterization of pilot lots are essential. This role is suited for a self‑directed, goal‑oriented, collaborative engineer who thrives on creative problem‑solving. The work environment includes a general office and clean‑room/lab setting.

• Innovate new processes to enable the technology roadmap
• Design and execute experiments, analyze data, draw conclusions, document, and communicate results
• Own tools and process modules in the area
• Establish feasibility of new processes with hands‑on processing of pilot lots on production equipment
• Characterize results using quantitative metrology tools
• Automate or improve established processes
• Document methods and workflows in MES‑ready format
• Plan for statistical process control (SPC) practices as appropriate
• Evaluate production yield challenges and recommend improvements
• Collaborate with device physicists, research technicians, and test engineers to participate in the overall product R&D cycle

• Bachelor's degree or equivalent experience in a related technical discipline required
• 0‑5 years of related experience desired
• Proficient computer skills – Word, Excel & Outlook
• Ability to communicate clearly in written and spoken English
• Strong data analysis skills (fluency in Excel, MATLAB, JMP, Python, SQL, or equivalent is helpful)
• Ability to use inspection equipment (microscopes, FIB/SEM, interferometers), semiconductor fabrication equipment, and wet bench chemistry
• Direct experience with one or more key wafer fabrication processes
• Familiarity and/or strong desire to learn microelectronic/semiconductor and MEMS fabrication techniques
• Applicants must be either a U.S. citizen or permanent resident

• Wafer processing tools for semiconductor or MEMS fabrication
• Infrared detector technology
• Statistical Process Control and Design of Experiments familiarity desired
• Lean Six Sigma or other problem‑solving/decision‑making methods (8D, Kepner‑Tregoe, or equivalent)

$90,800.00‑$

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non‑merit based factor made unlawful by federal, state, or local laws.