Engineering Lead — Microelectronics Packaging; .5D/3D
Listed on 2026-11-04
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Engineering
Electronics Engineer, Packaging Engineer, Mechanical Engineer
Raytheon Technologies, Advanced Technology sector, seeks an Engineering Project Leader to drive strategy and development of a microelectronics packaging portfolio, including 2.5D and 3D heterogeneous integration. You will guide CRAD programs, craft proposals, and collaborate across Raytheon to mature concepts into programs.
This onsite role supports multiple locations including Goleta, CA, and requires Top Secret clearance.
As a Engineering Lead — Microelectronics Packaging (2.5D/3D), you will play an important part at Raytheon in Goleta, CA, United States.
The position is based in Goleta, CA, United States.
This opportunity is part of our work in Management & Operations, Engineering.
The advertised compensation is 157..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Engineering Lead — Microelectronics Packaging (2.5D/3D) role in the description above.
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