Principal Wafer Process Engineer - 2nd shift

Date Posted:

Country: United States of America

Location: US-CA-GOLETA-B01 ~ 6825 Cortona Dr ~ BLDG B01

Position Role Type: Onsite

U.S. Citizen, U.S. Person, or Immigration Status Requirements: U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract.

Security Clearance Type: None/Not Required

Security Clearance Status: Not Required

At RTX, the world's largest aerospace and defense company, 185,000 great minds are united by purpose and inspired to make a difference solving the world’s most complex problems. With our three market leading businesses, world-class operations and investments in research and development, we offer capabilities and opportunity no one else can. Together, we push the boundaries of known science and find new ways to connect and protect our world.

Raytheon brings the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. We deliver solutions that help our nation and allies defend freedoms and deter aggression, creating a safer, more secure world. Join us and help shape the future of aerospace and defense.

Raytheon Vision Systems (RVS) is a world leader in the research, design and manufacturing of focal plane arrays and flight-based vision systems. Our Focal Plane Operations Process Engineering department provides world class semiconductor and focal plane array manufacturing processes in support of production and development products. We have an opportunity for a talented Principal Wafer Process Engineer – 2nd shift with a background in semiconductor manufacturing or thin film deposition.

The Focal Plane Process Engineering department at RVS supports semiconductor wafer fabrication of challenging Electro-Optical applications in the Space, Tactical, Airborne and Emerging markets. The candidate will work with and lead other process engineers, skilled technicians, and cross-functional teams to develop strategies and processes for improving the fab performance and output using our metrics.

The ideal candidate will have technical proficiency in various fabrications of semiconductor components or microelectronics using lithography, deposition, furnace, dry etch, wet etch, and metrology as well as proficiency and comfort in interfacing with multiple functions including Product Engineering, Systems Engineering, Quality, Mechanical Design Engineering, Factory Management, Equipment Engineering and Process Engineering.

• Managing process development and improvement projects, including novel processing techniques, yield increase, throughput, and safety improvements
• Responsible for reviewing material in WIP, certifying operators, dispositioning out of flow material, and hands on processing of novel detector designs
• Providing Process Ownership of vacuum coating tools, etch tools, or lithography tools
• Developing requirements and qualification plans for new equipment procurements.
• Work in a cleanroom environment with full cover all garments.

• Typically requires a degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 8 years of prior relevant experience.
• Experience in Semiconductor Engineering, Manufacturing Engineering, and/or Process Engineering in Optics, Electro-Optics, Semiconductor, Microelectronics or Wafer Processing environment.

• Experience with wet etch, metal-lift off, lithography, plasma cleaning, and associated semiconductor process equipment
• Experience with principles of vacuum system operations
• Experience with principles of photolithography
• Experience with etch (dry and wet)
• Experience with infrared detector technology and semiconductor…