MEMS Process Engineer — Wafer Bonding & Packaging
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Engineering
Process Engineer, Packaging Engineer, Manufacturing Engineer, Quality Engineering
Job Description & How to Apply Below
Seek Thermal, Inc. is seeking a MEMS Semiconductor and Assembly Process Engineer to oversee MEMS sensor die from wafer fabrication through wafer-level packaging and testing.
The role spans front-end processes and back-end assembly, coordinating with external suppliers to sustain yield and qualify new processes for production. The candidate will design DOEs, apply SPC/FMEA in a production setting, and communicate findings across design, test, reliability, and quality teams.
Our organisation is growing, and we are hiring a MEMS Process Engineer — Wafer Bonding & Packaging in Goleta, CA, United States.
Consider building your career as a MEMS Process Engineer — Wafer Bonding & Packaging at Seek Thermal, Inc.
The MEMS Process Engineer — Wafer Bonding & Packaging position in the Engineering field is open for applications.
We have an opening for a MEMS Process Engineer — Wafer Bonding & Packaging in Goleta, CA, United States within Engineering.
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