MEMS Process Engineer — Wafer Bonding & Packaging
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Engineering
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Manufacturing / Production
Job Description & How to Apply Below
Seek Thermal, Inc. is seeking a MEMS Semiconductor and Assembly Process Engineer to oversee MEMS sensor die from wafer fabrication through wafer-level packaging and testing.
The role spans front-end processes and back-end assembly, coordinating with external suppliers to sustain yield and qualify new processes for production. The candidate will design DOEs, apply SPC/FMEA in a production setting, and communicate findings across design, test, reliability, and quality teams.
Are you ready to take on the MEMS Process Engineer — Wafer Bonding & Packaging role at Seek Thermal, Inc?
Full responsibilities and requirements are described in the listing above.
Learn more about the MEMS Process Engineer — Wafer Bonding & Packaging role in the description above.
We appreciate your interest in this position.
Join Seek Thermal, Inc and contribute to our ongoing work.
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