Wafer Backside Processing Technician

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Performs a variety of technical tasks associated with backside wafer processing and assembly operations. This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes. This is a second shift position from 2:30 pm to 11:00 pm M-F.

• Hybridization Support Clean and inspect diced die using approved solvents and cleaning methods. As needed operate hybridization tools and maintain process parameters for yield optimization.
• Wicking & Underfill Perform wicking operations to ensure proper underfill application. Monitor curing cycles and maintain accurate process logs.
• Wire bonding Prepare substrates, load programs, perform wire bonding. Inspect bonds for quality and reliability using microscopes and metrology tools.
• General Responsibilities Maintain detailed records of SPC charts, tool usage, and consumables. Follow ISO Class 6 cleanroom protocols and 6S principles. Schedule and coordinate WIP for efficient movement between backside processes. Inspect and disposition nonconforming product.

• High School Diploma or equivalent; technical coursework preferred.
• 1–2 years of experience in semiconductor assembly or wafer processing.
• Familiarity with cleanroom operations and chemical handling.
• Ability to read and follow paper and digital travelers.
• Strong attention to detail, communication, and teamwork skills.

• Ability to stand and walk for extended periods (up to 8–10 hours per shift).
• Frequent bending, stooping, and reaching to handle wafers and assemblies.
• Manual dexterity for handling small components and precision tools.
• Ability to lift and carry items up to 25 lbs.
• Comfortable working in full cleanroom gowning (coveralls, gloves, mask, eye protection).
• Visual acuity for detailed inspection under microscopes.

Salary Range: $42,800.00-$57,100.00

Pay Transparency The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.