Second-Shift Microelectronics Packaging Technician

Teledyne Technologies Incorporated is hiring a Production Technician in Goleta, California. In this role, you will be responsible for building and packaging advanced thermal imaging cameras in a cleanroom environment. Key duties include microelectronics assembly support, ultrasonic cleaning, and documentation tasks. The ideal candidate should have a high school diploma or equivalent, with at least two years of experience in electronics.

The compensation ranges from $37,200 to $49,600 annually.
Step into the Second-Shift Microelectronics Packaging Technician role at Teledyne FLIR in Goleta, CA, United States and grow with us. We are currently recruiting a Second-Shift Microelectronics Packaging Technician for our team in Goleta, CA, United States. This is a genuine role to take on the Second-Shift Microelectronics Packaging Technician role at Teledyne FLIR. As a Second-Shift Microelectronics Packaging Technician, you will play an important part at Teledyne FLIR in Goleta, CA, United States.