Advanced Packaging Director in Silicon Valley

Position: Advanced Packaging Director Role in Silicon Valley
Join SK hynix America as the Director of System in Package Architecture, located in San Jose, CA. Lead innovative designs focused on High Bandwidth Memory in this onsite role.

You will oversee the complete development of SiP architectures, specifically enhancing performance through strategic research and collaborations. Responsibilities include the design of testing vehicles and guiding the roadmap for SOC and HBM integration in 2.5D and 3D packaging. This position requires exceptional management skills and a strong ability to unify engineering teams around a common strategy.

Key Responsibilities:

• Maximize SiP performance through advanced packaging designs

• Develop mechanical and electrical testing vehicles

• Pioneer research for SOC and HBM integration

• Lead collaboration with internal and external teams

Requirements:

• Bachelor’s degree in Electrical Engineering or related field

• 7+ years of experience in advanced packaging

• Strong capabilities in managing high-performing teams

• Proven cross-functional alignment abilities

• Exceptional communication skills

Leverage your technical expertise to advance semiconductor technologies at SK hynix, driving the creation of superior memory solutions.
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