Senior Packaging Thermal Architect

Role Overview

The Senior Thermal Architect will lead thermal design and strategy for next-generation GPU, AI accelerators, and data center products. This role is critical to enabling high-performance computing at scale while meeting stringent thermal requirements. You will define thermal architecture across silicon, package, and platform levels, ensuring optimal thermal performance for products approaching multi‑kilowatt levels.

Key Responsibilities

• Define and deliver advanced packaging thermal solutions for advanced GPU/AI products.
• Architect thermal strategies for 3
  
  DIC and advanced packaging technologies, including chiplets and heterogeneous integration.
• Develop analytical and experimental methods for thermal characterization and prediction.
• Drive co‑optimization of thermal, electrical, and mechanical design across silicon, package, and system levels.
• Push the boundaries of thermal management to support Moore’s Law progression.
• Evaluate and integrate emerging cooling technologies (e.g., liquid cooling, immersion cooling) for data center sustainability.
• Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance.
• Engage with external customers and ecosystem partners to align thermal solutions with product requirements.

Qualifications

Minimum qualifications:

• MS or PhD in Mechanical Engineering, Thermal Sciences, or related field.
• 10+ years in thermal design of semiconductor products.
• Proven track record in thermal architecture and advanced packaging.
• Proficient in thermal simulation tools (e.g., CFD, FEA) and experimental validation.

Preferred qualifications:

• 10+ years experience in high‑performance computing or data center products.
• Proven track record in GPU/AI thermal architecture and advanced packaging.
• Experience with rack‑scale cooling solutions and liquid cooling technologies.
• Familiarity with AI/GPU performance trends and their thermal implications.
• Strong understanding of power delivery, energy efficiency, and cooling technologies.
• Ability to influence architecture decisions and drive innovation across global teams.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Location

Primary: US, Arizona, Phoenix
Additional: US, Oregon, Hillsboro

Business Group

Intel Foundry – cutting‑edge silicon process and packaging technology leadership for the AI era, enabling customers to design flagship products and driving global manufacturing scale and supply chain excellence.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock, bonuses, health, retirement, and vacation. More information:
Benefits Details

Annual Salary Range

US: USD  – . The range reflects the minimum and maximum target compensation for the position across all US locations.

Work Model

This role requires an on‑site presence. Job posting details (such as work model, location or time type) are subject to change.

Seniority Level

Mid‑Senior Level

Employment Type

Full‑time

Job Function

Information Technology
Semiconductor Manufacturing