Semiconductor Manufacturing & Architecture Analyst

Apply for the Semiconductor Process Analyst position at Semi Analysis
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Semi Analysis is an independent research and analysis firm specializing in the semiconductor and AI industries. Our coverage spans the entire supply chain, from fabrication processes to advanced AI models, software, and infrastructure. We serve senior leaders at leading semiconductor and AI companies worldwide.

We are seeking an experienced, clever, and motivated Semiconductor Process Analyst with a background in failure analysis, reliability, or process integration engineering. This role, based in the United States, focuses on the hands‑on analysis of manufacturing innovations related to AI and datacenter products—from the system level down to the transistor. The analyst will work independently, collaborate across a globally distributed team, and deliver insights on cutting‑edge manufacturing processes, design choices, optimizations, and trade‑offs.

• Conduct detailed manufacturing, integration, and process analysis of AI and datacenter hardware (e.g., GPUs, ASICs, CPUs, and associated systems).
• Analyze and document semiconductor manufacturing processes, including FEOL, BEOL, and advanced packaging techniques, based on physical inspection and acquired data.
• Identify competitive advantages, disadvantages, and generational changes based on findings.
• Monitor and report on trends in semiconductor technology, process development, and device research.
• Serve as a recognized authority on the current state of the art in AI and datacenter process architectures.
• Work with design experts and market analysts to develop actionable market insights and reports.

• 3+ years of industry experience in packaging, BEOL, or FEOL engineering, or an equivalent role such as Reliability Engineer, Hardware Engineer, Debug Engineer, Process Integration Engineer, or Failure Analysis Engineer.
• Direct experience in debug, physical failure analysis, electrical failure analysis, or fault isolation.
• Functional knowledge of process integration or product architecture on advanced nodes.
• Understanding of Design Technology Co‑Optimization (DTCO) principles and their application.

• Experience with advanced packaging (e.g., 2.5D/3D), high‑speed interconnects, and advanced compute R&D.
• Broad understanding of advanced manufacturing processes across CMOS logic, memory (HBM, GDDR), networking, and emerging technologies.
• Hands‑on experience with sample preparation and analytical tools such as SEM, (P)
  FIB, STEM, EMMI/IREM,
  * BIRCH, and nanoprobing.
• Proven ability to interpret analytical data, such as micrographs and materials, to infer process and design characteristics.
• Familiarity with Python for data analysis and complex engineering tasks.
• Strong professional network of experts and excellent communication skills.
• Strong organizational skills and an understanding of statistics and process controls.

Mid‑Senior level

Full‑time

Management and Manufacturing

Semiconductors

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