Senior Co-Design Architect: Power, Thermal & Packaging Futures

NVIDIA is seeking a seasoned Co-Design Architect to push the physical limits of chip design in a role that crosses architecture, silicon, systems, and manufacturing. You will identify where constraints erode competitiveness and craft cross-domain responses to leap beyond existing bounds.

Responsibilities include analyzing packaging, power delivery, and thermal limits against roadmaps, and developing solutions that ensure testability and reliability across future products.

We are looking to fill the Senior Co-Design Architect:
Power, Thermal & Packaging Futures position at NVIDIA in Hillsboro, OR, United States.

This is a great role to take on the Senior Co-Design Architect:
Power, Thermal & Packaging Futures role at NVIDIA.

As a Senior Co-Design Architect:
Power, Thermal & Packaging Futures, you will play an important part at NVIDIA in Hillsboro, OR, United States.

We invite applications for the Senior Co-Design Architect:
Power, Thermal & Packaging Futures position located in Hillsboro, OR, United States.