Advanced Packaging Module Engineer: Plating & Process Innovation
Listed on 2026-10-11
-
Engineering
Process Engineer, Manufacturing Engineer, Packaging Engineer, Electronics Engineer
Intel Corporation in Hillsboro, Oregon, is seeking a Module Development Engineer to advance semiconductor manufacturing capabilities. You will develop and optimize advanced processes, run feasibility studies, and enable high-volume production for next-generation device architectures.
This role emphasizes process innovation, cross-functional collaboration, and delivering scalable solutions to strengthen Intel's industry leadership.
Step into the Advanced Packaging Module Engineer:
Plating & Process Innovation role at Intel Corporation in Hillsboro, OR, United States and grow with us.
Join us at Intel Corporation as our next Advanced Packaging Module Engineer:
Plating & Process Innovation in Hillsboro, OR, United States.
We are currently recruiting a Advanced Packaging Module Engineer:
Plating & Process Innovation for our team in Hillsboro, OR, United States.
This is a genuine opportunity to take on the Advanced Packaging Module Engineer:
Plating & Process Innovation role at Intel Corporation.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).