Module Development Defect Metrology Engineer

Job Details:

Job Description:

As a Module Development Engineer, you will play an essential role in driving advancements in semiconductor manufacturing and packaging technologies r work will focus on developing, and optimizing cutting-edge manufacturing metrology defect inspection tool and scaling high-volume production. From tool selection to process integration and equipment solutions, you will ensure robust and efficient processes that support Intel's leadership in innovation and advanced technology development.

Collaborating with cross-functional teams and external partners, your contributions will directly impact Intel's ability to deliver industry-leading products. Business group You will be part of Intel's Advanced Packaging Technology Development organization, dedicated to crafting next-generation packaging solutions that support Intel's innovation and manufacturing objectives. This group drives advancements in semiconductor technology by enabling high-volume production of cutting-edge defect inspection tools.

Your team will play a pivotal role in ensuring the successful integration of advanced technologies while contributing to Intel's broader vision of technological leadership.

• Lead the development of advanced manufacturing metrology defect inspection tool development, including new tool selection, automation optimization, equipment metrology development, and system integration.
• Drive process and hardware development of defect inspection tool to enable high-volume manufacturing and future technology innovations.
• Develop and execute technology roadmaps to guide future manufacturing needs and set industry standards.
• Partner with equipment and material suppliers to implement enabling process technologies and drive advancements.
• Optimize production efficiency, manufacturing techniques, and output for both new and existing tools.
• Leverage statistical process control and data analytics to enhance process stability and drive continuous improvement.
• Recommend and implement modifications to operational equipment to improve efficiency and scalability.
• Collaborate with cross-functional teams to ensure seamless process integration and alignment with project deliverables.

• Demonstrated success in leading programs from strategy formation through high-volume production and continuous improvement initiatives.
• Recognized technical leadership with a proven ability to solve complex engineering challenges and drive innovative solutions.
• Strong collaboration skills across functional areas like yield, operations, and supplier management.

• Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM field with 6+ years of semiconductor experience OR Master's degree in the same fields with 4+ years of semiconductor experience OR PhD in the same fields with 2+ years of semiconductor experience.
• +2 years of experience in:
  Manufacturing process development, statistical process control, and process improvement methodologies.
• Hands‑on experience in wafer‑level assembly, semiconductor processing, or advanced packaging technology in developing defect inspection method.

• Experience in metrology for advanced packaging technologies, such as hybrid bonded interconnects, ultra‑fine pitch solder connections, or RDL‑based packaging.

This role will require an on‑site presence.

* Job posting details (such as work model, location or time type) are subject to change.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age,…