Module Engineering PhD Intern Summer

Job Details:

Job Description:

In this role, you will contribute to the development and optimization of manufacturing processes for a specific module within semiconductor production. You will work hands‑on to sustain and improve manufacturing equipment, troubleshoot issues, and support qualification activities, all while collaborating with engineering teams to achieve production goals. This internship offers a unique opportunity to apply your academic knowledge, gain practical skills, and explore potential career paths in a dynamic and innovative environment.

As part of Intel Foundry Services, you will join a team that focuses on diffusion and implantation processes within semiconductor manufacturing. This group is dedicated to advancing technology and achieving excellence in production methodologies. By working collaboratively, the team supports Intel's broader mission of driving innovation and delivering high-quality solutions to meet global technological demands.

• Support the development and implementation of semiconductor manufacturing processes for a specific module.
• Sustain and improve manufacturing equipment performance, ensuring operational efficiency and reliability.
• Assist in equipment troubleshooting and qualification activities to meet production standards.
• Collaborate with engineering teams to optimize process control methodologies and ensure production targets are achieved.
• Apply statistical analysis and design experiments to enhance process reliability and throughput.
• Gain hands‑on experience in materials and device characterization techniques, such as SEM and TEM.
• Contribute to the continuous improvement of process control systems and methodologies.

• Ph.D. degree in progress in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field of study.
• Hands‑on experience and or knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition techniques.
• Familiarity with statistical data analysis and design of experiments methodologies.
• Experience in materials and physical device characterization, such as SEM or TEM.

• Advanced transistor device structures and architectures including fabrication (Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, Ion Implantation, Surface treatments and modification) with in-depth knowledge of semiconductor device physics and process integration.
• Technical skills such as scripting languages (i.e., Python, JSL, Perl, TCL), or programming languages (i.e., SQL, C/C++, etc.) and statistical data analysis is a plus.
• Semiconductor processing fundamentals (lithography, wet etch, dry etch, chemical and or mechanical polishing, etc.).
• Design of experiments and data analysis expertise.
• Expertise in Materials and physical device characterization (SEM, TEM, etc.) and fundamentals of semiconductor device testing.
• Process control systems, methodologies, sources of variability, and statistics.

This internship provides a unique platform for growth, innovation, and collaboration.

Student / Intern

Shift 1 (United States of America)

US, Oregon, Hillsboro

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

N/A

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