Quantum Packaging SI/PI Engineer - Shape Quantum Hardware
Listed on 2026-10-13
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Engineering
Packaging Engineer, Hardware Engineer
Intel Corporation in Oregon is seeking an experienced Quantum Packaging SI/PI Engineer to model and simulate packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team.
The role emphasizes SI/PI modeling, validation, and optimization using tools like SIwave, HFSS, and ADS. Collaboration with hardware teams and stakeholders is essential to meet ambitious quantum packaging goals in a fast-paced research environment.
Join us at Intel Corporation as our next Quantum Packaging SI/PI Engineer
- Shape Quantum Hardware in Hillsboro, OR, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 142..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Quantum Packaging SI/PI Engineer
- Shape Quantum Hardware role in the description above.
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