Shift Wafer Yield Engineer — Failure Analysis & Root Cause
Listed on 2026-10-13
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Engineering
Quality Engineering, Test Engineer, Electrical Engineering
Intel seeks an experienced LYA Engineer for back-end package and wafer-level assembly analysis in Hillsboro, Oregon. You will design, test, and characterize assembly technologies, bridging between engineers, technicians, and customers.
Expect hands-on lab work, data-driven failure analysis, and cross-functional collaboration to identify root causes and drive improvements. The role emphasizes program priorities, effective communication, and a willingness to work across teams in a fast-paced
This posting is for the Shift Wafer Yield Engineer — Failure Analysis & Root Cause role at Intel Corporation, based in Hillsboro, OR, United States.
We invite applications for the Shift Wafer Yield Engineer — Failure Analysis & Root Cause position located in Hillsboro, OR, United States.
The following role is for a Shift Wafer Yield Engineer — Failure Analysis & Root Cause with Intel Corporation.
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