Thin-Film Module Development Engineer — ALD/CVD/PVD
Listed on 2026-10-15
-
Engineering
Electrical Engineering
Intel Corporation in Hillsboro, Oregon seeks a highly motivated Thin Films Metals Module Development Engineer to accelerate development for high-k/metal gate, contact, and interconnect applications. You will own deposition process development across ALD, CVD, PVD, and related platforms, designing experiments to meet device performance and yield targets.
MINIMUM qualifications include a PhD in a STEM field and 1+ years in deposition tech, with proficiency in data analysis and materials
We are looking to fill the Thin-Film Module Development Engineer — ALD/CVD/PVD position at Intel Corporation in Hillsboro, OR, United States.
Our organisation is growing, and we are hiring a Thin-Film Module Development Engineer — ALD/CVD/PVD in Hillsboro, OR, United States.
This opening is for the Thin-Film Module Development Engineer — ALD/CVD/PVD role at Intel Corporation.
We are seeking a motivated Thin-Film Module Development Engineer — ALD/CVD/PVD to join Intel Corporation in Hillsboro, OR, United States.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).