Quantum Interposer Packaging Engineer
Listed on 2026-10-15
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Engineering
Packaging Engineer
Intel Corporation in Oregon’s Quantum Computing Group seeks a Quantum Interposer Design Engineer to lead physical design and integration of interposers for quantum packaging. You will collaborate with multidisciplinary teams, validate designs with DRC/LVS, and communicate milestones to stakeholders.
The role requires strong problem solving, excellent communication, and adaptability in a fast-paced research environment focused on silicon quantum dot technology and scalable quantum systems.
We are looking to fill the Quantum Interposer Packaging Engineer position at Intel Corporation in Hillsboro, OR, United States.
Full responsibilities and requirements are described in the listing above.
Learn more about the Quantum Interposer Packaging Engineer role in the description above.
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