Quantum Packaging Thermal Engineer
Listed on 2026-10-15
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Engineering
Packaging Engineer, Mechanical Engineer
Intel Corporation's Quantum Packaging Modeling Engineer role in Oregon focuses on thermal modeling and simulation of packaging hardware, from silicon test chips to heat spreaders, enabling cross-disciplinary co-design. You will partner with mechanical designers and stakeholders to deliver robust, efficient thermal solutions and report milestones with clear documentation.
The position requires strong communication, analytical thinking, and adaptability to a fast-paced quantum research
This posting is for the Quantum Packaging Thermal Engineer role at Intel Corporation, based in Hillsboro, OR, United States.
Full responsibilities and requirements are described in the listing above.
Learn more about the Quantum Packaging Thermal Engineer role in the description above.
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