Quantum IC Substrate Design Engineer 5D/3D Packaging
Listed on 2026-10-16
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Engineering
Packaging Engineer, Electrical Engineering, Engineering Design & Technologists, Systems Engineer
Intel Corporation in Oregon is seeking a Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team. The role focuses on designing large form factor IC substrates within a multidisciplinary team, advancing silicon quantum dot technology and scalable quantum systems.
You will work with Siemens Xpedition, engage with SI/PI/thermal analyses, and coordinate tapeouts with substrate suppliers, contributing to state-of-the-art packaging solutions and on-site
We are looking to fill the Quantum IC Substrate Design Engineer - 2.5D/3D Packaging position at Intel Corporation in Hillsboro, OR, United States.
The Quantum IC Substrate Design Engineer - 2.5D/3D Packaging role at Intel Corporation is now open for applications in Hillsboro, OR, United States.
Join us at Intel Corporation as our next Quantum IC Substrate Design Engineer - 2.5D/3D Packaging in Hillsboro, OR, United States.
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