Module Development Engineer PhD Intern
Listed on 2026-10-16
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Engineering
Process Engineer, Manufacturing Engineer
As a Module Engineering PhD Intern, you will play a pivotal role in supporting the development and implementation of advanced manufacturing processes for a specific module in semiconductor manufacturing. You will collaborate with engineering teams to optimize process control methodologies, troubleshoot and sustain equipment operations, and contribute to production targets. This hands‑on experience will enable you to build critical skills, apply academic knowledge to real‑world challenges, and explore future career opportunities in a fast‑paced, innovative environment.
Business group:
Intel Foundry delivers cutting‑edge manufacturing solutions that power the future of technology. The group focuses on enabling semiconductor innovation by optimizing processes, advancing equipment capabilities, and driving production excellence. As part of Intel Foundry, you will join a team dedicated to delivering world‑class manufacturing outcomes while contributing to Intel's leadership in the semiconductor industry.
- Support the development and optimization of manufacturing processes for a specific module.
- Assist with troubleshooting, sustaining, and improving manufacturing equipment performance.
- Conduct equipment maintenance and qualification activities to ensure operational efficiency.
- Collaborate with engineering teams to refine process control methodologies and achieve production goals.
- Apply PhD‑level knowledge and research to practical engineering challenges.
- Participate in projects that support Intel's business objectives, fostering innovation and technical growth.
Minimum Qualifications:
- Must be pursuing a PhD degree in Electrical Engineering, Chemical Engineering, Material Science, Mechanical Engineering, Nuclear Engineering, Physics, Chemistry, or a Semiconductor related STEM field.
- 2+ years of hands‑on experimental research experience (e.g., doctoral thesis research, laboratory instrumentation, advanced material characterization, optics, plasma, or thin‑film processing).
- GPA: 3.5
- Knowledge of semiconductor processing fundamentals such as lithography, etch, film deposition, implant, or chemical‑mechanical planarization.
- Proficiency in materials and physical device characterization (e.g., SEM, TEM).
- Experience with custom data analysis tools (Python, MATLAB, JSL).
Job Type: Student / Intern
Shift: Shift 1 (United States of America)
Primary
Location:
US, Oregon, Hillsboro
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation or ordinance.
Benefits:We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Annual Salary Range for jobs which could be performed in the US: $- USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role.
Work Model:This role will require an on‑site presence.
* Job posting details (such as work model, location or time type) are subject to change.
Additional Information:Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
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