Advanced Packaging Materials Engineer
Listed on 2026-10-16
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Engineering
Materials Engineering, Process Engineer, Quality Engineering, Packaging Engineer
Intel Corporation’s Materials Technology Development (MTD) team in Hillsboro, Oregon, is seeking a highly motivated materials engineer to advance packaging materials, processes and equipment. You will collaborate across cross-functional teams to deliver innovative solutions that meet strict quality and reliability requirements in a fast-moving environment.
The role requires a Bachelor's degree with 4+ years of experience (or a Master's with 3+ years) in Materials Science, Metallurgy, Chemical
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This posting is for the Advanced Packaging Materials Engineer role at Intel Corporation, based in Hillsboro, OR, United States.
We are looking to fill the Advanced Packaging Materials Engineer position at Intel Corporation in Hillsboro, OR, United States.
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