Process Integration Engineer: TEM & FIB Specialist
Listed on 2026-10-17
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Engineering
Process Engineer, Electronics Engineer, Systems Engineer, Test Engineer
Intel Corporation in Hillsboro, Oregon, seeks a Process Integration Development Engineer to perform FIB lamella preparation and TEM characterization on semiconducting nanostructures. The role supports TD and advanced metrology, focusing on imaging, diffraction, and advanced analysis.
The position requires hands-on FIB/TEM experience in industry, strong problem solving, and the ability to work independently or in teams. On-site work is required in Hillsboro.
We have an opening for a Process Integration Engineer: TEM & FIB Specialist in Hillsboro, OR, United States within Engineering.
The Process Integration Engineer: TEM & FIB Specialist position in the Engineering field is open for applications.
This role, Process Integration Engineer: TEM & FIB Specialist at Intel Corporation, could be your next opportunity.
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